Lamination Process In Pcb

Now cut the piece of paper and tape it on printed pcb design.

Lamination process in pcb. Later the pcb is allowed to cure at a high temperature. For laminating process we need low quality thin and glossy paper. The press platens gives high amount of heat to carrier press plates. Pcb fusion and lamination technology process 1 lamination press.

The most fundamental manufacturing technique in modern pcb fabrication is sequential lamination. For lamination the internal layers of the pcb are subjected to under extreme temperature 375o f and pressure 275 to 400 psi. Don t worry for prints on paper it does not come down during a lamination process. When selecting pcb technology for your board you should know the pcb factory have different lamination options to meet your required pcb technology of your board.

Simply put this term describes the process of building up a pcb layer by layer using multiple subcomposites of copper and insulating pcb laminate material. Rcypcb has very powerful equipment and extensive technical experience in the laminating process. Our multilayer pcb quality is trustworthy china pcb factory. The press platens are hollow.

The lamination press is the hydraulic press that applies high pressure under high temperature to.