Laminate Substrate Technology

Evenly distributed bumps across the bottom surface of the substrate provide the electrical connection to the system board.

Laminate substrate technology. Meanwhile substrate based packages fall into several categories such as ceramic and organic laminate. Find out which product is best for you. The difference is that the substrate size is much smaller than most of the pcbs you have seen. Design flows are not able to address multiple technology designs ic laminate package and pcb need to be designed together em interactions between substrates need to be modeled and accounted for the need to move from disjointed tools design flows to.

When laying the substrate under the laminate does not require professional skills work experience and special tools but you must carefully follow certain rules. Technology of laying the substrate under the laminate. Fr is a short form of fire retardant and an amazing insulator. Learn which teslin substrate grade is best suited for each particular print technology.

Because of its thermal stability. Ic laminate package multi technology module design challenges. Lower cost while meeting performance targets remains a driver for substrate development. Ceramic substrates are based on aluminum oxide aluminum nitride and other materials.

It is the most affordable and common substrate nowadays which is a fiberglass epoxy laminate. Teslin substrate is available in a versatile array of product grades to meet the demands of specific printing process and end use applications. Moko technology the best place for high quality substrate. Founded 1985 laminate technologies lamtech is your one source solution for customized laminated panels and fabricated components and we re never more than a phone call away.

Laminate packages employ a bga design which utilizes a plastic or tape laminate substrate over a leadframe substrate and places the electrical connections on the bottom of the package rather than around the perimeter. Ball grid array packaging. From the literacy of performance depends primarily on the performance and durability of the laminate. Ceramic based packages are used for surface mount devices cmos image sensors and multi chip modules.

The wirebonded device and the complete assembly are then overmolded and solder balls attached to form the package. Substrates with finer feature sizes will be needed in the future and the jury is still out on the choice of laminate glass or silicon interposers. The material contains a good amount of bromide which is a non reactive halogen.